Silicon Motion SM662GAC-BDS | 100-B EMMC 5.1 TLC NAND 64GB I-TEMP

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.32.00.71

Automotive

Yes

PPAP

Unknown

Cell Type

TLC NAND

Chip Density (bit)

512G

Programmability

Yes

Timing Type

Synchronous

Interface Type

Serial e-MMC

Supplier Temperature Grade

Automotive

Command Compatible

Yes

ECC Support

Yes

Support of Page Mode

No

Mounting

Surface Mount

Package Height

1.4

Package Width

14

Package Length

18

PCB changed

153

Supplier Package

BGA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Pin Count

a count of all of the component leads (or pins)

153

Boot Block

No